This image is imagemapped.
Centre left is Magnetron sputtering chamber (silver colored. Contains three 3" S-gun sputtering heads. Deposits thin layers of high resistivity cermet (ceramic/metal conglomerate Cr:SiO), and TiW). Centre rear is a thermal/e-gun evaporator for deposition of AuGe, Au, Ti, Pt, Ni. Right side is RIE (Reactive Ion Etcher) process chamber and control electronics with RF power supplyu in right foreground.Windows and lights are filtered as photoresist is sensitive to blue light.
